JPH0193763U - - Google Patents
Info
- Publication number
- JPH0193763U JPH0193763U JP18996587U JP18996587U JPH0193763U JP H0193763 U JPH0193763 U JP H0193763U JP 18996587 U JP18996587 U JP 18996587U JP 18996587 U JP18996587 U JP 18996587U JP H0193763 U JPH0193763 U JP H0193763U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- jig
- straightening
- support plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 2
- 229910001182 Mo alloy Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987189965U JPH0429588Y2 (en]) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987189965U JPH0429588Y2 (en]) | 1987-12-16 | 1987-12-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0193763U true JPH0193763U (en]) | 1989-06-20 |
| JPH0429588Y2 JPH0429588Y2 (en]) | 1992-07-17 |
Family
ID=31480971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987189965U Expired JPH0429588Y2 (en]) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429588Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018148163A (ja) * | 2017-03-09 | 2018-09-20 | 日本特殊陶業株式会社 | 半導体製造装置用部品の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6016998U (ja) * | 1984-06-13 | 1985-02-05 | 株式会社東芝 | セラミツク焼成用治具 |
| JPS62119155A (ja) * | 1985-11-20 | 1987-05-30 | 鳴海製陶株式会社 | 低温焼成セラミツクス基板の焼成方法 |
-
1987
- 1987-12-16 JP JP1987189965U patent/JPH0429588Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6016998U (ja) * | 1984-06-13 | 1985-02-05 | 株式会社東芝 | セラミツク焼成用治具 |
| JPS62119155A (ja) * | 1985-11-20 | 1987-05-30 | 鳴海製陶株式会社 | 低温焼成セラミツクス基板の焼成方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018148163A (ja) * | 2017-03-09 | 2018-09-20 | 日本特殊陶業株式会社 | 半導体製造装置用部品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0429588Y2 (en]) | 1992-07-17 |